Summary

Larger photomasks could increase production capacity for high-end chips and RAM. Samsung and TSMC will join Intel in adopting ASML's latest High NA extreme ultraviolet (EUV) lithography chip fab machines, ASML announced . The three companies also unveiled a new initiative to adopt larger 12-inch photomasks that will hopefully boost manufacturing yields and lower chipmaking costs. Samsung and TSMC will deploy ASML's NA EUV tech by 2028 and 2030 respectively, while 12-inch photomasks are expected to arrive in advanced node production by 2033.

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