AI Summary

Samsung plans to use ASML’s high‑NA EUV machines for volume manufacturing by 2028, while TSMC will adopt the same technology from 2030, according to Bloomberg. High‑NA EUV, or high numerical aperture extreme ultraviolet, is the most advanced chip‑making technology in ASML’s latest machines. The technology has already been used briefly by Intel and SK Hynix. It speeds production and improves yields by simplifying the process and removing certain steps, and it enables denser wafers.

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