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Record-breaking IBM chip uses trick to cram in 100 billion transistors
IBM's latest chip packs in twice as many transistors as the current state-of-the-art chip by adding a second layer of silicon circuitry
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IBM's latest semiconductor breakthrough involves a novel approach to increasing transistor density. The company's new chip achieves a record-breaking 100 billion transistors by incorporating a second layer of silicon circuitry.
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