Summary

Researchers at Central South University in China have investigated how the surface-protrusion density of silver-coated copper (Cu@Ag) powder particles affects the rheological properties and electrical conductivity of conductive pastes, aiming to develop high-performance, low-temperature conductive pastes without the addition of silver (Ag) nanoparticles. The large-scale industrial adoption of Cu@Ag pastes remains relatively limited compared with conventional Ag-based formulations, mainly due to challenges involving long-term stability, oxidation resistance, processing conditions, and electrical reliability. Improving the performance of Cu@Ag pastes through particle surface engineering could therefore support their broader industrial adoption.

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